Paper 2024/1423 Original: eprint.iacr.org/2024/1423 ↗
Towards package opening detection at power-up by monitoring thermal dissipation
Abstract
Among the various threats to secure ICs, many are semi-invasive in the sense that their application requires the removal of the package to gain access to either the front or back of the target IC. Despite this stringent application requirements, little attention is paid to embedded techniques aiming at checking the package's integrity. This paper explores the feasibility of verifying the package integrity of microcontrollers by examining their thermal dissipation capability.
Metadata
- Available format(s)
PDF- Category
- Attacks and cryptanalysis
- Publication info
- Preprint.
- History
- 2024-09-11: last updated
- 2024-09-11: published
- Short URL
- https://ia.cr/2024/1423
- License
- https://creativecommons.org/licenses/by-nc/4.0/
BibTeX
@misc{cryptoeprint:2024/1423,
author = {Julien Toulemont and Geoffrey Chancel and Fréderick Mailly and Philippe Maurine and Pascal Nouet},
title = {Towards package opening detection at power-up by monitoring thermal dissipation},
howpublished = {Cryptology {ePrint} Archive, Paper 2024/1423},
year = {2024},
url = {https://eprint.iacr.org/2024/1423}
}